Physical property sheet of silica gel

Appearance (Component A)

White / Rransparent

Appearance (Component B)

Transparent / Red

Proportion of Component A & B

1:1

Viscosity of component A

cp6000

Operating time (25℃)

min30

Curing condition (℃/h)180℃

/300 seconds

Density /g·cm

31.1

Hardness (JISA)

50

Elongation at break /%

≥300

Tear strength /KN·m-1

≥

Tensile strength /Mpa

≥5.0

Linear shrinkage /%

0.1

Membrane switch parameter

Electrical properties

Working voltage

≤42VDC (25VAC)

Working current

≤100mA

Loop resistance

≤70Ω (between 250mm)

Insulation resistance

≤100MΩ

Substrate voltage withstand

≤1500VDC

Environmental adaptability

Working temperature

-30℃~70℃

Storage temperature

-40℃~80℃

Working humidity

≤95%

PCB

Raw material

Conventional plate

FR4 (ShengYi S1141)

High frequency plate

Rogers、 Taconic、 Arlon

High TG plate

S1000-2M、LianMao IT180A and supporting P film

Halogen free plate

ShengYi S1155、S1165 series

Substrate voltage withstand

≤1500VDC

Resistance welding

Sun ink (Taiyo PSR-2000/4000 series)

Chemical Potion

AMMAT Brown syrup (MS300)、Roman Haas plating solution (125T，EP1000) etc

surface treatment

Tin spraying, lead-free tin spraying, heavy gold, OSP, heavy tin, gold plating, hard gold plating (50u”)

Selective surface treatment

Heavy gold + OSP, heavy gold + finger, gold, gold finger, Shen tin + gold finger

Technical parameter

Minimum line width / spacing

Outer 2.0/2.0mil (complete copper thickness 30um), inner layer 2.5/2.5mil (1/3, 1/2OZ)

Minimum drilling

0.10mm (mechanical drilling) /3mil (laser drilling)

Minimum welding ring

4mil

Minimum layer thickness

2mil

Thickness of the most thick copper

7 OZ

Maximum size of finished product

600x800mm

Plate thickness

Two sided board 0.2-7.0mm, multilayer board: 0.4-7.0mm

Solder bridge

≥0.08mm

Plate thickness and aperture ratio

26：1

Jack ability

0.2-0.8mm

Tolerance

Metal hole

± 0.075mm (limit + 0.05)

Non metallic hole

± 0.05mm (limit +0/-0.05mm or +0.05/-0mm)

Contour tolerance

± 0.1mm (limit + 0.05-0.075mm)

Functional testing

Insulation resistance

50 ohms (normal)

Peel strength

1.4N/mm

Thermal stress test

280 ℃, 20seconds

Resistance weld hardness

≥6H

Electric measuring voltage

10V-250V

Warp degree

≤0.7%